LG Chem has begun mass production and supply of semiconductor strippers to Amkor Technology, marking its first move into the market.
The material is customised for Amkor’s new production line and cuts photoresist and residue removal time by about 50 per cent.
The launch supports LG Chem’s push to expand high-value electronics materials as AI and HBM demand lift advanced packaging needs.
A semiconductor stripper is a critical process material used to remove photoresist (PR) and residue remaining on semiconductor substrates after circuit patterning. As semiconductor circuits continue to shrink, residue removal performance has become increasingly important, directly affecting manufacturing yield and product reliability. As a result, stripper performance is considered a key factor in determining semiconductor quality.
LG Chem entered the semiconductor stripper market by leveraging the technological expertise and customer support capabilities it developed through its display stripper business. The company demonstrated its technology’s competitiveness by successfully passing the rigorous qualification process required by Amkor, a leading global OSAT customer, with its first semiconductor stripper product.
The stripper supplied to Amkor has been customised and optimised for the company’s new production line. Compared with existing products, it reduces the process time required to remove photoresist and process residue by approximately 50 per cent, significantly improving manufacturing efficiency.
Demand for advanced process materials continues to grow as artificial intelligence (AI) investments and high-bandwidth memory (HBM) demand drive the expansion of advanced semiconductor packaging technologies.
Kim Dong Choon, chief executive officer, LG Chem, said, “Through our collaboration with Amkor, a world-class semiconductor packaging and testing company, we will further strengthen our competitiveness in delivering customized materials optimized for customers’ manufacturing processes.”
Earlier this year, LG Chem announced a strategy to more than double the size of its electronics materials business. As part of this initiative, the company is expanding its semiconductor packaging materials portfolio — including copper-clad laminates (CCL), die attach films (DAF), and photo imageable dielectric (PID) — while accelerating the growth of its high-value-added electronic materials business.
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ALCHEMPro News Desk
