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Japan’s Resonac to produce high-purity HF gas at Tokuyama plant

Japan’s Resonac to produce high-purity HF gas at Tokuyama plant



Japan’s Resonac to produce high-purity HF gas at Tokuyama plant

Resonac Corporation (President and CEO: Hidehito Takahashi; hereinafter “Resonac”) announces that it will newly launch production of high-purity hydrogen fluoride (HF) gas at its Tokuyama Plant (Shunan City, Yamaguchi Prefecture, Japan) within 2026. Combined with its existing production at the Kawasaki Plant (Kawasaki City, Kanagawa Prefecture, Japan), Resonac plans to establish a two-site production system in Japan. This product is used in the etching process of semiconductor circuits and is seeing increasing demand in advanced technologies such as cryogenic etching, which enables high-precision processing of fine semiconductor structures. Resonac will strengthen its supply system to ensure stable supply.High-purity gases are essential materials used in the front-end semiconductor manufacturing process for circuit formation on wafers, and demand for these gases has been increasing in line with the expansion of the semiconductor market. In particular, driven by the growth of data centers and AI-related applications, semiconductor devices are increasingly adopting three-dimensional, high-density integration structures. These structures require technologies capable of forming deep and fine features that penetrate multiple stacked layers with high precision.

Resonac will start producing high-purity hydrogen fluoride gas at its Tokuyama Plant in Japan within 2026, adding to Kawasaki output.
The two-site system is meant to support stable supply for semiconductor etching processes as demand rises.
Growth in data centres, AI applications and cryogenic etching is raising purity and availability requirements.

Cryogenic etching has attracted attention as a key technology to meet these requirements. By performing etching under extremely low-temperature conditions, this technique enables processing while protecting sidewalls, thereby allowing the formation of deeper, smoother, and more precise microstructures than conventional methods.

High-purity hydrogen fluoride gas plays an important role in such advanced etching processes, including the removal of oxide films. As cryogenic etching technologies become more widespread, higher levels of purity and stable supply are increasingly required. This product is expected to support the formation of fine and deep circuit structures required for advanced semiconductor processes, and demand for it is projected to grow going forward.

In response to this market environment, Resonac plans to begin production of this product at its Tokuyama Plant within 2026 to strengthen its supply capacity in line with growing demand. Resonac offers a broad lineup of high-purity gases used in semiconductor manufacturing processes, covering both etching and film deposition applications. Through this initiative, Resonac will continue to meet the needs of the expanding semiconductor materials market, respond promptly to customer requirements, and contribute to the development of the semiconductor industry.

Note: The headline, insights, and image of this press release may have been refined by the ALCHEMPro staff; the rest of the content remains unchanged.

ALCHEMPro News Desk




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